Based on Intel® Atom™ Processor E3900 Series

Rugged Design and Energy-Efficiency 

for Deeply Embedded Applications

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DFI launched new products to provide enhanced processing capability, low-power consumption, and brilliant graphic performance under Goldmont architecture with 14nm manufacturing node. Relying on DFI’s innovative abilities in design and manufacture, these products are small-sized, fanless, and support extended temperature range from -40°C up to +85°C, which makes it a perfect suite for many space-constrained and thermally limited embedded applications.
Multiple 
Storage Choice
4K/2K
High Resolution
Energy
Saving
Wide Operating
Temperature
Flexible
OS Support

Wide Operating Temperature

These products are able to survive under a wide -40°C to +85°C operating temperature range.

Satisfying the demands of industries in harsh environments with the need of thermal solution designs.

Also, this outstanding fanless design makes awesome system integration.

85°C
-40°C
Attach to 部分 4
Energy Saving but High Performance
With the latest processor under Goldmont architecture, these boards offer 30% significant improvement
for processing and intense graphic performance (Gen9), it also saves an average of 9 watts TDP energy.
9w
TDP average
30%
Processing
improvement
Gen9
Intel graphics
Experience Clarity with 4K UHD High-Resolution
The new series powered by enhanced graphic engine from hardware decoding of HEVC and VP9 codecs supports 4K high resolution (DP: 4096x2304 @ 60Hz) and three independent displays for medical and multimedia solution.
Multiple Storage Choice: eMMC, SSD/ M.2 Module
As for storage, these new products will support high speed SATA 3.0 drives, SSD and eMMC 5.0 options up to 128GB.
Specially, advanced M.2 interface that integrating multiple functions including Wi-Fi/LTE/mSATA is the ideal choice
for automation, storage and design of IoT appliances.
M.2
eMMC
(optional)
SSD
(optional)
Complete Product Line
Based on the new E3900 series processor, DFI has created a wide array of rugged and reliable
industrial motherboards and modules, including Mini-ITX, SBC, Pico-ITX, COM Express, Qseven R2.1.
Endless IoT Possibilities with Windows 10 Compatibility
Collocating with Windows 10 platform characterized by its security functions, DFI’s E3900 series products featured small-sized and rugged-design and are ready to meet IoT demands. With the integration, these products can comprehensively help our clients simplify development of IoT-connected devices and generate total IoT solution.

Industrial Motherboard
System-On-Module
AL171/173
-204-pin DDR3L SODIMM up to 16GB
-1 VGA, 1 HDMI, 1 LVDS
-1 PCIe x1, 1 M.2, 1 Mini PCIe
-2 GbE, 6 COM, 5 USB 3.0, 4 USB 2.0

Mini-ITX
2.5" Pico-ITX
AL051
-204-pin DDR3L SODIMM up to 8GB
-1 DP++, 1 LVDS
-1 Full-size Mini PCIe, 1 M.2
-2 GbE, 1 COM, 2 USB 3.0, 2 USB 2.0

AL968
-204-pin DDR3L SODIMM up to 16GB
-1 VGA, 1 LVDS, 1 DDI
-1 PCIe x1, 1 M.2, 1 Mini PCIe
-1 GbE, 4 USB 3.0, 8 USB 2.0, 2 SATA 3.0


AL700
-DDR3L 4GB/8GB Memory Down
-1 LVDS, 1 DDI
-4 PCIe x1
-1 GbE, 1 USB 3.0, 8 USB 2.0


AL9A3
-DRR3L 4GB/8GB Memory Down
-1 LVDS, 1 DDI
-4 PCIe x1
-1 GbE, 2 USB 3.0, 8 USB 2.0


AL9A2
- DDR3L 2GB/4GB Memory Down
-1 LVDS, 1 DDI
-4 PCIe x1
-1 GbE, 2 USB 3.0, 8 USB 2.0

COM Express Type 6
COM Express Type 10
Qseven
COM Express Type 10
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